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| recommended soldering pad layout led die 0.8 1.0 0.8 1.6 0.3 cathode mark 1.0 0.8 0.8 0.7 0.8 recommended soldering pad layout *flat lens thin package 1.6 x 0.8 x 0.8mm *low current requirements *high light output *compatible with ir solder-process *industry standard footprint *4000 pcs per reel *rohs compliant electrical & optical characteristics at t a = 25c part number emitting color chip material viewing angle 2 1/2 forward voltage @20ma (v) luminous intensity @20ma (mcd) water clear lens (nm) (nm) deg typ max min typ PL00130-WCG17 ultra-bright green alingap 573 575 110 2.2 2.6 28.0 45.0 dominant wave length peak wave length features package dimensions are in millimeters . tolerance is 0.15mm unless otherwise specified. pl00130 series smd led 0603 package top view 04.06.11 rev 0 jas absolute maximum ratings at t a = 25c power dissipation?????????????????????..??..?. 78mw reverse voltage (<10a) ???..????????..?....?..?...????.?... 5.0v max forward current ????..??????.??.......???????..?.. 30ma peak forward current (1/10 duty cycle, 0.1ms pulse width) ?..?????????... 100ma operating temperature range ????? ????..???.......?...?- 40c to +85c storage temperature range ?????????.???..?..?....?.. -40c to +85c reflow soldering temperature????????. .??.?...?.... 260c for 10 seconds tel:(866) 695 4162 tel:(719) 589 3122 fax:(719) 589 3592 www.p-tec.net p-tec corp. 2405 commerce circle alamosa co 81101
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